Helix Is Building the Next-Generation Interconnect and Power Delivery Architecture to Make AI GPUs and Accelerators Radically More Energy-Efficient

We design and manufacture the infrastructure directly beneath the chip: advanced high-density interconnect stacking architecture that delivers power and transfer data with far less energy loss, lower thermal load, and higher performance per watt.

Our leadership includes C-suite and senior executives from ASE, Foxconn, Lam Research, Unimicron, and Kinsus, global companies that underpin the current AI hardware ecosystem and supply NVIDIA, AMD, Broadcom, and Google. Our AI team brings together engineers who have deployed production AI systems at TSMC and component manufacturers supplying Apple alongside physics-informed AI researchers from Harvard and MIT.

We combine this manufacturing expertise with proprietary high-fidelity datasets and physics-informed AI to co-optimize signal integrity, power delivery, thermal behavior, and manufacturability, accelerating development cycles and dramatically improving performance, efficiency, and yield for next-generation AI infrastructure.